Organic silicon thermal conductive gel
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JDB920N Organic silicon thermal conductive gel
JDB920N is an additive two component silicone thermal sealing material with good flowability and self-healing properties. After curing, a soft thermal conductive silicon gel is formed. Its excellent electrical properties make it very suitable for sealing various electronic components with high purity requirements. It has the characteristics of providing cushioning, shock absorption, heat dissipation and other functions for electronic components.
Feature
 Two component 1:1 (volume ratio) mixing ratio, appropriate room temperature operation time.

 It can be cured at room temperature or quickly by heating, without releasing small molecules during curing.

 Low modulus, low internal stress, and strong resistance to cold and hot impacts.

 Excellent adhesion, self-healing, and excellent high-temperature stability at 200 ℃.
Parameter

项目

典型值

测试标准

混合前物性(23±2℃/50±5%RH )

组分

--

A

B 

 

--

外观

--

半流淌

半流淌

 

--

粘度

Pa•s

250±50

250±50

 

GB/T 15223-2008

比重

g/cm3

2.0±0.10

2.0±0.10

 

GB/T 13477.2-2002

混合后物性(23±2℃/50±5%RH )

重量比混合

--

A:B=1:1

 

GB/T 13477.2-2002

外观

--

 

---

粘度

Pa•s

250±50

 

GB/T 15223-2008

可操作时间25℃

min

60~70

 

--

完全固化时间25℃

h

4~8

 

 

完全固化时间(100℃)

min

10~25

 

GB/T 13477.5-2002

固化后性能( 23±2℃/50±5%RH×24hours )

硬度

Shore oo

50±5

 

GB/T 531.1—2008

导热系数  

W/m•K

2.0±0.2

 

GB/T 10297-1998

介电强度

kV/mm

15

 

GB/T 1408.1—2006

介电常数(60HZ)

 --

≤4.0

 

GB/T 1409—2006

体积电阻率

Ω·cm

application
Used for heat dissipation and packaging protection of motors and high-power electronic components, especially for components with high thermal conductivity requirements.
Usage method
Instructions for use

 Clean the surface of the object being glued and keep the clean and dry surface.

 The product quickly cures at room temperature and fully cures within 24 hours.


matters needing attention

 Before use, please refer to the MSDS in detail.

 Rubber materials should be stored in a sealed manner, and the mixed rubber materials should be used up at once to avoid waste.

 This product is not a hazardous material, but avoid contact with skin and eyes.

 After long-term storage, the filler in the adhesive will settle. Please mix well before use, without affecting performance.

 Contact with a certain amount of the following chemicals can cause the adhesive to not cure:

1. Organic compounds containing N, P, and S.

2. Ionic compounds containing elements such as Sn, Pb, Hg, and As.

3. Compounds containing alkynes and polyvinyls.

 In order to avoid the above phenomenon, before using glue sealing, the residual rosin on the device should be wiped clean as much as possible, and solder with low lead content should be used as much as possible.


Packaging specifications

 50cc, 200cc, 400cc, 5 gallons, 55 gallons.


Storage and transportation

 Store away from children, keep the product away from light and heat, and store it in a sealed container.

 When stored unopened at or below 28 ° C, the product has a shelf life of 6 months from the date of production.

 This product is non hazardous and is stored and transported as a general chemical.


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