Self repairing composite dielectric silicon gel
Home >> Products >> IGBT packaging adhesive... >> Self repairing composite diel...
JDB9401 Self repairing Composite Dielectric Insulation Encapsulated Silicon gel
Two component addition molding room temperature vulcanization
Feature
 High transparency and self-healing ability

● Good dielectric properties

 Minimal vulcanization shrinkage

● Durable to aging, with permanent retention of elasticity and hardness

 It can be vulcanized at room temperature or quickly by heating
Parameter
application
 Protection encapsulation of high-power IGBT

● Suitable for protection in electrical/electronic applications

 Insulation encapsulation of electronic devices

● Other general sealing applications
Usage method
1. Weighing: Weigh components A and B in a 1:1 weight ratio.

2. Mixing: Mix the two components of the adhesive thoroughly. After the two components are fully mixed, the liquid mixture should have a uniform appearance. If there are stripes or spots, it indicates insufficient mixing and will lead to incomplete vulcanization.

3. Defoaming: vacuuming and defoaming in a specialized mixing equipment. The mixed rubber material and mixing container can also be placed in a vacuum foaming equipment for vacuuming and defoaming treatment. During the vacuum bubble removal process, the liquid level of the mixture may rise to 3-4 times the original volume, and then automatically break and collapse. After breaking the bubble, maintain a vacuum for 4-6 minutes, and finally release the vacuum. However, due to its low viscosity and slow vulcanization rate, it can also be left standing at room temperature for automatic defoaming.

4. Rubber filling and vulcanization: Pour the prepared rubber material into the area that needs to be sealed or filled, and naturally vulcanize at room temperature. Heating can significantly accelerate the vulcanization rate. It is recommended to vulcanize at 80 ℃ for 2 hours or 120 ℃ for 1 hour.