Silicone thermal conductive potting adhesive
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JDB920 silicone thermal conductive potting adhesive
JDB920 is a two component addition molding thermal conductive silicone sealant with good fluidity, excellent thermal conductivity, and good electrical insulation performance, making it very suitable for packaging equipment or devices such as motors, power semiconductors, thyristors, rectifiers, and transformers.
Feature
 Low viscosity and good flowability;

 No solvents, no curing by-products, easy to repair;

● Reduce mechanical stress and tension caused by mechanical, thermal shock, and vibration;

 Stable mechanical and electrical performance between -50~+200 ℃;

 Excellent flame retardancy, fully compliant with the EU ROHS directive requirements.
Parameter
application
Used for heat dissipation and packaging protection of motors and high-power electronic components, especially for components with high thermal conductivity requirements.
Usage method
Instructions for use

 Clean the surface of the object being glued and keep the clean and dry surface.

 Before mixing, the two parts A and B in storage should be thoroughly stirred and evenly mixed.

 Mix evenly in a 1:1 mass ratio, twice the volume of the colloid, in a container to prevent the colloid from expanding and overflowing during the defoaming process.

 After mixing, the entrained air can be removed by vacuum method, and the air can be extracted at a vacuum degree of 28 "Hg. The bubbles can be removed in 2 minutes, and the extraction time can be extended when the volume is large.


matters needing attention

 Before use, please refer to the MSDS in detail.

 Rubber materials should be stored in a sealed manner, and the mixed rubber materials should be used up at once to avoid waste.

 This product is not a hazardous material, but avoid contact with skin and eyes.

 The A component of this product contains crosslinking agents, while the B component contains Pt catalysts.

 Contact with a certain amount of the following chemicals can cause the adhesive to not cure:

1. Organic compounds containing N, P, and S.

2. Ionic compounds containing elements such as Sn, Pb, Hg, and As.

3. Compounds containing alkynes and polyvinyls.

 In order to avoid the above phenomenon, before using glue sealing, the residual rosin on the device should be wiped clean as much as possible, and solder with low lead content should be used as much as possible.


Packaging specifications

 40kg/set (A component 20kg/barrel+B component 20kg/barrel).


Storage and transportation

 Keep away from children, keep components A and B away from light and heat, and store in a sealed container.

 When stored unopened between 5 and 30 ° C, the product has a shelf life of 6 months from the date of production.

 This product is non hazardous and is stored and transported as a general chemical.


Please read carefully

All data included here was measured at the Jiaduobao laboratory and is only for product selection reference. We recommend conducting sufficient testing in your laboratory or factory to determine whether the product meets all of your requirements.