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Silicone potting adhesive
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JDB910 silicone thermal conductive potting adhesive
JDB910 silicone thermal conductive potting adhesive (R07) is a two-component addition molding silicone material that cures at room temperature or at elevated temperature. This two component elastic silicone is designed for encapsulating and protecting electronic products under harsh conditions. After thoroughly mixing components A and B in a 1:1 (weight ratio) ratio during use, the product will solidify within a certain period of time, forming an elastic buffer material.
Feature
● Low viscosity, good fluidity, and can penetrate into small component gaps;

● Resistance to moisture, dirt, and other atmospheric components;

● No solvents, no curing by-products, easy to repair;

● Reduce mechanical stress and tension caused by mechanical, thermal shock, and vibration;

● Stable mechanical and electrical performance between -50 to 200 ℃;

● Excellent flame retardant performance, fully compliant with the EU ROHS directive requirements.
Parameter
application
The product is used for encapsulating sensors, power modules, solar cells, LED driver modules, inverters, and other applications.
Usage method
Instructions for use

● Clean the surface of the object being glued and keep the clean and dry surface.

● Before mixing, the two parts A and B in storage should be thoroughly stirred and evenly mixed.

● Mix and use in a 1:1 mass ratio, pour into a container 4 times the volume of the gel to prevent the gel from expanding and overflowing during the defoaming process.

● After mixing, the entrained air can be removed by vacuum method, and the air can be extracted at a vacuum degree of 28 "Hg. The bubbles can be removed in 2 minutes, and the extraction time can be extended when the volume is large.


matters needing attention

● Before use, please refer to the MSDS in detail.

● Rubber materials should be stored in a sealed manner, and the mixed rubber materials should be used up at once to avoid waste.

● This product is not a hazardous material, but avoid contact with skin and eyes.

● After long-term storage, the filler in the adhesive will settle. Please mix well before use, without affecting performance.

● Contact with a certain amount of the following chemicals can cause the adhesive to not cure:

1. Organic compounds containing N, P, and S.

2. Ionic compounds containing elements such as Sn, Pb, Hg, and As.

3. Compounds containing alkynes and polyvinyls.

● In order to avoid the above phenomenon, before using glue sealing, the residual rosin on the device should be wiped clean as much as possible, and solder with low lead content should be used as much as possible.


Packaging specifications

● Component A, 25kg/barrel.

● Component B, 25kg/barrel.


Storage and transportation

● Keep away from children, keep components A and B away from light and heat, and store in a sealed container.

● When stored unopened at or below 28 ° C, the product has a shelf life of 6 months from the date of production.

● This product is non hazardous and is stored and transported as a general chemical.


Please read carefully:

The various data provided in this manual are all obtained from testing under specific conditions and are only for reference. To ensure the safety and applicability of the material under the final use conditions, it is necessary for the customer to confirm the applicability of the product through experiments. If you have any questions during use, please contact us, and we will use our expertise and processing experience to provide you with services.
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