Single component addition molding fast curing adhesive
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JDB811T200 single component heat curing thermal conductive adhesive
JDB811T200 single component heating curing adhesive is an additive high strength adhesive thermal conductive silicone material. It can be applied to the bonding and sealing of various electronic and electrical components, such as electronic devices in industries such as home appliances, automobiles, and communication.
Feature
 Single component, no need to mix before use, easy to operate;

 Addition of silicone, no low molecular weight detachment during curing, resulting in a more stable product size after curing;

 Excellent thermal insulation performance helps to dissipate heat and protect thermal electronic components;

 Stable mechanical and electrical performance between -60-250 ℃;

 Excellent flame retardant performance, fully meeting the requirements of EU environmental directives.
Parameter

项目

典型值

  测试标准

固化前性能  ( 23±2℃/50±5%RH )

外观                      --

灰色膏状物

 目测

比重                      g/cm3

 2.7±0.1

 GB/T 533-2008

固化后性能  ( 23±2℃/50±5%RH×7days )

固化条件 150℃)         Min

20


  --

邵氏硬度                  Shour A

85±10

  GB/T 531. 1—2008

延伸率                    %

≥20

  GB/T 528—2009

拉伸强度                  MPa

≥4.5

  GB/T 528—2009

导热率                    W/(m.K)

2.0±0.2

  ISO22007-2

剪切强度  (AL/AL)         MPa

≥4.4

  GB/T 7124—2008

介电强度                  kV/mm

22

  GB/T 1408.1—2006

介电常数(1MHz)         --

4.9

  GB/T  1409—2006

体积电阻率                Ω ·cm

≥2.0× 1013

  GB/T  1410—2006

工作温度                  ℃

-50~200


 --

application
The product is suitable for various electronic and electrical applications such as bonding, sealing, thermal conductivity, insulation, protection, moisture-proof, and dust-proof, such as in refrigerator electrical components. It replaces aluminum foil in the application of condensing tubes and side panels, evaporating tubes and container bonding, etc.
Usage method
Instructions for use

 Clean and dry the surface of the adhesive object, and remove any pollutants such as rust, dust, and oil that may affect adhesion.

 Extrude the adhesive with a special tool and apply it to the cleaned joint surface.

 After the adhesive application is completed, it is moved into an oven or heated environment for curing. According to the actual situation, it is better to extend the curing time and increase the curing temperature appropriately.


matters needing attention

 Rubber materials should be sealed (0 ± 5 ℃) for refrigerated storage. Long term storage at room temperature or high temperature environment will shorten the storage period.

 This product is not a hazardous material, but avoid contact with skin and eyes.

 Contact with a certain amount of the following chemical substances can cause the adhesive to not cure or cure incompletely:

  Organic compounds containing N, P, and S.

  Ionic compounds containing elements such as Sn, Pb, Hg, and As.

  Compounds containing alkynes and polyvinyls.

 In order to avoid the above phenomenon, before using the glue solution for sealing and dispensing, it is necessary to wipe off the residual rosin on the device as much as possible, and use soldering tin with low lead content as much as possible.

 After use, the rubber hose of this product should be sealed for storage and reuse. This product is for industrial use only.


Packaging specifications

 300ml/bottle, 24 bottles per box.

 50ml/branch pipe installation.


Storage and transportation

 Store away from children.

 This product has a storage period of six months in an environment of (0 ± 5 ℃).

 This product is non hazardous and is stored and transported as a general chemical.


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