Thermal conductive silicone is a high-end thermal conductive compound, and the non conductive nature of the product can avoid risks such as circuit short circuits; It has cooling and bonding effects on electronic devices. It can solidify into high hardness elastomers in a short period of time. After solidification, it closely adheres to its contact surface to reduce thermal resistance, which is conducive to the heat transfer between the heat source and its surrounding heat sink, motherboard, metal shell, and shell. Thermal conductive silicone has the advantages of high thermal conductivity, good insulation performance, and ease of use. It has good adhesion to metals such as copper, aluminum, and stainless steel, and its curing form is dealcohol type, which does not cause corrosion on metal and non-metallic surfaces.
Thermal conductive silicone can be widely applied to the contact surface between the heating element (power tube, thyristor, electric heating stack, etc.) in various electronic products and electrical equipment, and the heat dissipation facilities (heat sink, heat dissipation strip, shell, etc.), playing a heat transfer medium role and performing functions such as moisture-proof, dustproof, corrosion-proof, and shockproof. Suitable for surface coating or overall sealing of various microwave devices such as microwave communication, microwave transmission equipment, microwave specialized power supplies, voltage stabilizing power supplies, etc. It is widely used as a substitute for thermal conductive silicone grease (paste) and thermal conductive adhesive pads for CPU and heat sink, intelligent control module of thyristor and heat sink, junction of transistor and electric heat regulator, filling and bonding between high-power electrical module and heat sink, and heat dissipation. After using this adhesive, the traditional connection method of using cards and screws can be removed, resulting in more reliable filling and heat dissipation, simpler process, and more economical cost.
For example, it can be widely used for the packaging of integrated circuits, microcomputer processors, Memory module, cache memory, sealed integrated chips, DC/AC converters, IGBT and other power modules, semiconductors, relays, rectifiers and transformers of personal portable computers. Electronic and electrical components are fixed and flame retardant, heat conductive, insulated, shockproof, moisture-proof and sealed. Heat dissipation of high-power LED products. Especially suitable for adhesive sealing with high requirements for thermal conductivity.
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